AMW200Pro Fully Automatic Wafer Mounter Features: |
Unique patent vacuum mounting technology without roller(Roller mounting as options) |
Configure with multi link wafer transfer robot |
Bernoulli arm for thinner wafer handling |
Wafer position & warpage intelligent mapping |
Fiber sensor for wafer alignment |
Contact chuck to handle various wafer |
Wafer cassette loading & unloading (Box Optional) |
Standard industrial PC control with 17’touch panel LCD |
Full SST cover & door with aluminium profile frame |
Built-in Ionizers for ESD protection |
Non-UV & UV tape capability |
AMW200Pro Fully Automatic Wafer Mounter Specifications: |
Wafer Size |
Diameter:4” , 5” , 6” & 8” Thickness:70 750 um |
Wafer Type |
Si , GaAs Single Flat, Double Flat or V-Notch |
Tape Type |
Blue Tape or UV Tape |
Frame Type |
6” DISCO or K&S, 8” DISCO or K&S; or Customer Specified |
Mounting Theory |
Vacuum Mounting or roller mounting |
Wafer Place Accuracy |
X-Y: +/- 0.5 mm : +/- 0.5° |
Input & Output |
Dual Input Wafer Cassette / Single Input Wafer Box (Optional) Dual Output Frame Cassette Customer Specified (Sample Supply) |
ESD Control |
Ion Fan |
Wafer Transfer |
Horizontal Multi-link Robot with Bernoulli Endeffector Wafer Position & Warpage Intelligent Mapping in Cassette |
Wafer Alignment |
Fiber Sensor for Wafer Alignment |
Control Unit |
Standard Industrial PC with 17” Touch Panel LCD / Windows O/S |
Air Supplier |
60 PSI CDA , 2.5 CFM |
Machine Cover |
White plastic plating cover |
Dimensions |
1136mm(W) x 1437mm(D) x 1747mm(H) |
Net Weight |
400kg |
AMESEMI 半导体型号及产品名称: |
ADW-08 plus |
半自动晶圆撕膜机(减薄后) |
ADW-08 |
半自动晶圆撕膜机(减薄后) |
AMS-12 |
半自动贴膜机(基板切割) |
AMW-08 AT |
半自动晶圆贴膜机(预切割膜) |
AMW-08 |
半自动晶圆贴膜机(切割膜) |
AMW-12 |
半自动晶圆贴膜机(切割膜) |
ATW-08 |
半自动晶圆贴膜机(减薄前) |
ATW- 12 |
半自动晶圆贴膜机(减薄前) |
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